Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/15/2018
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Application #:
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14567070
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Filing Dt:
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12/11/2014
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Publication #:
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Pub Dt:
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06/16/2016
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Inventor:
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Wing Shenq WONG
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Title:
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INTEGRATED CIRCUIT (IC) PACKAGE WITH A SOLDER RECEIVING AREA AND ASSOCIATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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28 ANG MO KIO INDUSTRIAL PARK 2, |
SINGAPORE,, SINGAPORE 569508 |
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MICHAEL W. TAYLOR |
255 S. ORANGE AVE. |
SUITE 1401 |
ORLANDO, FL 32801 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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CHEMIN DU CHAMP-DES-FILLES 39 |
PLAN-LES-OUATES |
GENEVA, SWITZERLAND 1228 |
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RAJ K. KRISHNAN |
STMICROELECTRONICS, INC. |
750 CANYON DRIVE, SUITE 300 |
COPPELL, TX 75019 |
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