Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/22/2018
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Application #:
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15651894
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Filing Dt:
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07/17/2017
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Inventors:
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Kuo-Hsin CHANG, Chung-Ping LAI
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Title:
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STRUCTURE AND METHOD OF BONDING CHIP WITH ELECTRONIC CIRCUIT
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2.312 PHOTON SCIENCE INSTITUTE UNIVERSITY OF MANCHESTER, OXFORD ROAD |
MANCHESTER, UNITED KINGDOM M13 9PL |
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TW PATENT OFFICE C/O PATENT OFFICE OF BA |
102 LINDENCREST CT |
SUGAR LAND, TX 77479-5201 |
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