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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/22/2018
Application #:
15401087
Filing Dt:
01/08/2017
Inventors:
Jy-Hwang Lin, Wen-Chieh Wang, Tien-Shang Kuo, Fu-Hsuan Chu, Hua-Wei Peng
Title:
SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
040886/0398Recorded: 01/08/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/03/2017
Exec Dt:
01/03/2017
Exec Dt:
01/03/2017
Assignee:
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU CITY, TAIWAN
Correspondent:
WINSTON HSU
P.O.BOX 506
MERRIFIELD, VA 22116
Assignment: 2
Reel/Frame:
041628/0080Recorded: 03/19/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Assignee:
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU CITY, TAIWAN
Correspondent:
WINSTON HSU
5F., NO.389, FUHE RD., YONGHE DIST.,
NEW TAIPEI CITY, TAIWAN

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