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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/29/2018
Application #:
15441188
Filing Dt:
02/23/2017
Publication #:
Pub Dt:
10/26/2017
Inventors:
Jun Chul KIM, Dong Su KIM, Jong Min YOOK
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
041803/0351Recorded: 02/23/2017Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/07/2017
Exec Dt:
02/07/2017
Exec Dt:
02/07/2017
Assignee:
(YATAP-DONG) 25, SAENARI-RO, BUNDANG-GU
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13509
Correspondent:
HAUPTMAN HAM, LLP
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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