Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2018
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Application #:
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15660958
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Filing Dt:
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07/27/2017
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Publication #:
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Pub Dt:
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11/23/2017
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Inventors:
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R. Scott West, Mike Kwon, Tao Tong, Michael Solomensky
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Title:
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Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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46430 FREMONT BOULEVARD |
FREMONT, CALIFORNIA 94538 |
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IMPERIUM PATENT WORKS |
P.O. BOX 607 |
PLEASANTON, CA 94566 |
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06/24/2024 01:24 AM
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