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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	D494544	Issue Dt:	08/17/2004	Application #:	29152841	Filing Dt:	12/28/2001
Inventors:	Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels et al
Title:	HIGH DENSITY INTERCONNECTION DEVICE

Assignment: 1

Reel/Frame:

012438/0174

Recorded: 12/28/2001

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

DULAI, HARJINDER

Exec Dt:

11/25/2001

CHEN, YEN-MING

Exec Dt:

11/12/2001

SZETO, COLIN

Exec Dt:

11/12/2001

LAURIN, EDWARD J.

Exec Dt:

12/15/2001

DANIELS, STEVE D.

Exec Dt:

12/06/2001

DROLET, JEAN FRANCOIS

Exec Dt:

12/05/2001

Assignee:

ATI TECHNOLOGIES, INC.

33 COMMERCE VALLEY DRIVE

THORNHILL, ONTARIO, CANADA L3T 7

Correspondent:

VEDDER, PRICE, KAUFMAN & KAMMHOLZ

MICHAEL J. TURGEON

222 NORTH LASALLE STREET, STE. 2600

CHICAGO, IL 60601

Assignment: 2

Reel/Frame:

026270/0027

Recorded: 05/12/2011

Pages: 8

Conveyance:

CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Assignor:

ATI TECHNOLOGIES INC.

Exec Dt:

10/25/2006

Assignee:

ATI TECHNOLOGIES ULC

1 COMMERCE VALLEY DRIVE EAST

MARKHAM, ONTARIO, CANADA L3T 7X6

Correspondent:

CHRISTOPHER J. RECKAMP

222 N. LASALLE STREET

VEDDER PRICE P.C.

CHICAGO, IL 60601

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