Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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29425315
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Filing Dt:
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06/21/2012
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Inventor:
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Hideyuki OSADA
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Title:
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HOLDING PAD FOR TRANSFERRING A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
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| LEYDIG, VOIT & MAYER |
| 700 THIRTEENTH STREET, N.W. |
| SUITE 300 |
| WASHINGTON, DC 20005 |
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