Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/03/1997
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Application #:
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08370597
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Filing Dt:
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01/10/1995
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Inventor:
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NICHOLAS A. ROUNDS
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Title:
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TRANSFER MOLDING PROCESS FOR ENCAPSULATING SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 INDEPENDENCE MALL WEST |
| PATENT DEPARTEMNT |
| PHILADELPHIA, PENNSYLVANIA 19106 |
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| MICHAEL B. FEIN |
| ROHM AND HAAS COMPANY |
| PATENT DEPARTMENT, 7TH FLOOR |
| INDEPENDENCE MALL WEST |
| PHILADELPHIA, PA 19106 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INDEPENDENCE MALL WEST, 2ND FLOOR |
| PHILADELPHIA, PENNSYLVANIA 19105 |
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| AMOCO CORPORATION/MARY JO KANADY |
| LAW DEPARTMENT - MAIL CODE 1907A |
| 200 EAST RANDOLPH DRIVE |
| P.O. BOX 87703 |
| CHICAGO, ILLINOIS 60680-0703 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL CODE 1907A |
| 200 EAST RANDOLPH DRIVE, P.O. BOX 87703 |
| CHICAGO, ILLINOIS 60680 |
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| AMOCO CORPORATION |
| MARY JO KANADY |
| LAW DEPARTMENT, MAIL CODE 1907A |
| 200 EAST RANDOLPH DRIVE, P.O. BOX 87703 |
| CHICAGO, IL 60680-0703 |
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