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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/14/2004
Application #:
10218559
Filing Dt:
08/14/2002
Inventors:
Morimasa Tanimoto, Satoshi Suzuki, Akira Matsuda, Kinya Sugie
Title:
LEAD MATERIAL FOR ELECTRONIC PART, LEAD AND SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
030344/0621Recorded: 05/03/2013Pages: 16
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/01/2013
Assignee:
1-9, DOJIMAHAMA 2-CHOME, KITA-KU
OSAKA-SHI, OSAKA, JAPAN 530-0004
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
1250 CONNECTICUT AVENUE, NW
SUITE-700
WASHINGTON, DC 20036-2657

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