Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/25/2001
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Application #:
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09733780
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Filing Dt:
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12/08/2000
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Publication #:
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Pub Dt:
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05/31/2001
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Inventors:
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Steve V. Drehobl, Joseph D. Fernandez, Mike Charles
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Title:
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Integrated circuit package having interchip bonding and method therefor
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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IL1-1145/54/63, P.O. BOX 6026 |
CHICAGO, ILLINOIS 60680-6026 |
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ZEYNEP GIESEKE |
330 N. WABASH AVENUE, SUITE 2800 |
LATHAM & WATKINS LLP |
CHICAGO, IL 60611 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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2355 W CHANDLER BLVD |
CHANDLER, ARIZONA 85224 |
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WILSON SONSINI GOODRICH & ROSATI, P.C. |
ONE MARKET PLAZA, SPEAR TOWER, SUITE 330 |
SAN FRANCISCO, CA 94105 |
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