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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09029608
Filing Dt:
05/15/1998
Publication #:
Pub Dt:
06/07/2001
Inventors:
NORIO FUKASAWA, TOSHIMI KAWAHARA, MUNEHARU MORIOKA, MITSUNADA OSAWA, YASUHIRO SHINMA et al
Title:
METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE
Assignment: 1
Reel/Frame:
009183/0260Recorded: 05/15/1998Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Exec Dt:
04/06/1998
Assignee:
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN, HATTORI, ET AL
RONALD F. NAUGHTON
1725 K STREET N.W.
SUITE 1000
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
020505/0724Recorded: 02/13/2008Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/24/2008
Assignee:
ONE OWENS CORNING PARKWAY
TOLEDO, OHIO 43659-0001
Correspondent:
OWENS COMING SCIENCE & TECHNOLOGY
BUILDING 21-0
2790 COLUMBUS ROAD
GRANVILLE, OH 43023

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