Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09749796
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Filing Dt:
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12/28/2000
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Publication #:
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Pub Dt:
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07/05/2001
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Inventors:
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Ja-Hyun Koo, Bum-Wook Park, Yong-Hee Lee
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Title:
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Automatic wire bonder and method for implementing thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SAN 136-1 AMI-RI, BUBAL-EUB, KYOUNGKI-DO |
ICHON-SHI, KOREA, REPUBLIC OF 467-8 |
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202-638-6666 |
JACOBSON, PRICE, HOLMAN & STERN, PLLCC |
YOON S. HAM |
400 SEVENTH STREET, NW. |
WASHINGTON, DC 20004 |
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