Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09766237
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Filing Dt:
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01/19/2001
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Publication #:
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Pub Dt:
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09/20/2001
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Inventors:
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Wei-Kung Wang, Gin-Chung Wang
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Title:
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Mold-in method and apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SEC. 2, YEN CHIU YUAN ROAD |
NO. 14 SUBLANE 3. LANE 61 |
NAN KANG DISTRICT, TAIPEI R.O.C., TAIWAN |
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SENNIGER, POWERS, LEAVITT & ROEDEL |
ROBERT M. BAIN |
ONE METROPOLITIAN SQUARE |
16TH FLOOR |
ST. LOUIS MISSOURI 63102 |
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