Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09819518
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Filing Dt:
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03/27/2001
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Publication #:
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Pub Dt:
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10/04/2001
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Inventor:
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Tomohiro Nishiyama
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Title:
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Method of forming solder bumps, method of mounting flip chips, and a mounting structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| HAYES, SOLOWAY ET AL. |
| NORMAN P. SOLOWAY |
| 175 CANAL STREET |
| MANCHESTER, NH 03101 |
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