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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09803904
Filing Dt:
03/13/2001
Publication #:
Pub Dt:
10/04/2001
Inventor:
Hideaki Onishi
Title:
Semiconductor integrated circuit device and fabrication method
Assignment: 1
Reel/Frame:
011610/0568Recorded: 03/13/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/01/2001
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
YOUNG & THOMPSON
ISIAH AVILA
SECOND FLOOR
745 SOUTH 23RD STREET
ARLINGTON, VA 22202
Assignment: 2
Reel/Frame:
013620/0537Recorded: 05/01/2003Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2002
Assignee:
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI
KANAGAWA 211-8668, JAPAN
Correspondent:
YOUNG & THOMPSON
BENOIT CASTEL
SECOND FLOOR
745 SOUTH 23RD STREET
ARLINGTON, VA 22202

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