Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09775322
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Filing Dt:
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02/01/2001
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Publication #:
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Pub Dt:
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10/25/2001
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Inventors:
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Roger J. Stierman, Gonzalo Amador, Howard R. Test
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Title:
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Structure and method for bond pads of copper-metallized integrated circuits
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474, M/S 3999 |
| DALLAS, TEXAS 75265 |
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| NAVARRO IP LAW GROUP, P.C. |
| GARY C. HONEYCUTT |
| 801 E. CAMPBELL RD. |
| SUITE 655 |
| RICHARDSON, TX 75081 |
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