Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/20/2004
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Application #:
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09817935
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Filing Dt:
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03/27/2001
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Publication #:
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Pub Dt:
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12/13/2001
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Inventors:
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Kazuki Matsumoto, Yukio Morozumi, Michio Asahina
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Title:
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METHOD FOR FORMING BONDING PAD STRUCTURES IN SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, NISHI-SHINIUKU 2-CHOME |
| SHINIUKU-KU, TOKYO, JAPAN |
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| KONRAD, RAYNES & VICTOR, LLP |
| ALAN RAYNES |
| 315 SOUTH BEVERLY DRIVE |
| SUITE 210 |
| BEVERLY HILLS, CA 90212 |
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