Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09250619
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Filing Dt:
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02/16/1999
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Publication #:
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Pub Dt:
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12/13/2001
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Inventors:
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ANDREW LIN, SHIH-MING LAN, HSIEN-LIANG MENG
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Title:
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METHOD OF FORMING AN OPENING IN A DIELECTRIC LAYER IN INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN II ROAD |
| HSINCHU, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 1340 REYNOLDS AVENUE |
| SUITE 114 |
| IRVINE, CA 92614 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. 2 |
| HSINCHU, TAIWAN R.O.C |
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| HICHMAN STEPHENS COLEMAN & HUGHES, LLP |
| PAUL L. HICKMAN |
| P.O. BOX 52037 |
| PALO ALTO, CA 94303-0746 |
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