Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09879144
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Filing Dt:
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06/13/2001
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Publication #:
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Pub Dt:
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01/31/2002
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Inventors:
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Koichi Hasegawa, Hideo Mitsuhashi, Katsuhisa Ookawa
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Title:
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Semiconductor wafer polishing end point detection method and apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| SUGHRUE MION ZINN MACPEAK & SEAS, PLLC |
| J. FRANK OSHA |
| 2100 PENNSYLVANIA AVE, NW |
| STE 800 |
| WASHINGTON, DC 20037-3213 |
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