Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09820549
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Filing Dt:
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03/29/2001
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Publication #:
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Pub Dt:
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01/31/2002
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Inventors:
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Lejun Wang, Haiying Li, Ching-Ping Wong
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Title:
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THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 505 TENTH STREET, N.E. |
| ATLANTA, GEORGIA 30332 |
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| TROUTMAN SANDERS LLP |
| TODD DEVEAU |
| 600 PEACHTREE ST., N.E. |
| SUITE 5200 |
| ATLANTA, GA 30308 |
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