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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/24/2002
Application #:
09820549
Filing Dt:
03/29/2001
Publication #:
Pub Dt:
01/31/2002
Inventors:
Lejun Wang, Haiying Li, Ching-Ping Wong
Title:
THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS
Assignment: 1
Reel/Frame:
011964/0531Recorded: 07/05/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/23/2001
Exec Dt:
05/23/2001
Exec Dt:
05/23/2001
Assignee:
505 TENTH STREET, N.E.
ATLANTA, GEORGIA 30332
Correspondent:
TROUTMAN SANDERS LLP
TODD DEVEAU
600 PEACHTREE ST., N.E.
SUITE 5200
ATLANTA, GA 30308

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