Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09818595
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Filing Dt:
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03/28/2001
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Publication #:
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Pub Dt:
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01/31/2002
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Inventors:
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Masako Okanuma, Tatsuhiro Yoshida, Hidenori Saito, Nobuhiro Higashida et al
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Title:
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PRECURSOR OF A HEAT RESISTANT RESIN, HEAT RESISTANT RESIN, INSULATING FILM AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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| SMITH, GAMBRELL & RUSSELL, LLP |
| MICHAEL A. MAKUCH |
| INTELLECTUAL PROPERTY GROUP |
| 1850 M STREET N.W. (SUITE 800) |
| WASHINGTON, DC 20036 |
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