Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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09329648
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Filing Dt:
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06/09/1999
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Publication #:
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Pub Dt:
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02/14/2002
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Inventors:
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MING-DOU KER, HSIN-CHIN JIANG
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Title:
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LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SECTION 4, CHUNG HSING ROAD |
| CHUTUNG, HSINCHU, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 1340 REYNOLDS AVENUE |
| SUITE 114 |
| IRVINE, CA 92614 |
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