Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/2002
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Application #:
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09931086
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Filing Dt:
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08/15/2001
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Publication #:
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Pub Dt:
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02/21/2002
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Inventors:
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Wen-Chun Liu, Yi-Hsiang Pan, Kuo-Yuan Lee
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Title:
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HEAT DISSIPATION MODULE FOR A BGA IC
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1, EAST 1ST ST., K.E.P.Z. |
KAOHSIUNG, TAIWAN R.O.C |
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DELLETT AND WALTERS |
JAMES H. WALTERS |
310 S. W. FOURTH AVENUE |
SUITE 1101 |
PORTLAND, OR 97204 |
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