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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/06/2002
Application #:
09741610
Filing Dt:
12/19/2000
Publication #:
Pub Dt:
02/28/2002
Inventors:
Chih-Pin Hung, Jung-Sheng Chiang
Title:
INTEGRATED CIRCUIT PAKAGE SUBSTRATE INTEGRATING WITH DECOUPLING CAPACITOR
Assignment: 1
Reel/Frame:
011424/0498Recorded: 12/19/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/12/2000
Exec Dt:
12/12/2000
Assignee:
26, CHI 3RD. RD., 811, NANTZE EXPORT, PROCESSING ZONE
KAOHSIUNG, TAIWAN R.O.C
Correspondent:
J.C. PATENTS, INC.
JIAWEI HUANG
7700 IRVINE CENTER DRIVE
SUITE 710
IRVINE, CALIFORNIA 92618-3043

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