Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09910278
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Filing Dt:
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07/19/2001
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Publication #:
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Pub Dt:
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03/07/2002
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Inventors:
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Chia-Yi Lin, Chih-Tsung Hou, Kung-Ming Huang, Ching-Kun Yeh
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Title:
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Thin-type semiconductor device and die pad thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| INTELLECTUAL PROPERTY PRACTICE GROUP |
| 101 FEDERAL STREET |
| BOSTON MA 02209 |
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