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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09829941
Filing Dt:
04/11/2001
Publication #:
Pub Dt:
03/14/2002
Inventors:
Guo-Quan Lu, Simon Sihua Wen
Title:
Dimple array interconnect technique for semiconductor device
Assignment: 1
Reel/Frame:
011709/0067Recorded: 04/11/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/03/2001
Assignee:
1872 PRATT DRIVE, SUITE 1625
BLACKSBURG, VIRGINIA 24060
Correspondent:
MCGUIREWOODS, LLP
MICHAEL E. WHITHAM
1750 TYSONS BOULEVARD
SUITE 1800
MCLEAN, VA 22102
Assignment: 2
Reel/Frame:
011709/0070Recorded: 04/11/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/04/2001
Exec Dt:
04/04/2001
Assignee:
657 WHITMORE HALL MAIL CODE 0111
BLACKSBURG, VIRGINIA 24061
Correspondent:
MCGUIRE WOODS, LLP
MICHAEL E. WHITHAM
1750 TYSON BOULEVARD, SUITE 1800
MCLEAN, VA 22102

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