Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09741131
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Filing Dt:
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12/19/2000
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Publication #:
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Pub Dt:
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03/28/2002
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Inventors:
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Tomoko Wake, Yasuaki Tsuchiya
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Title:
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METHOD OF FORMING A COPPER-CONTAINING METAL INTERCONNECT USING A CHEMICAL MECHANICAL PLANARIZATION (CMP) SLURRY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA, 5-CHOME |
| TOKYO, JAPAN |
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| PAUL J. ESATTO, JR. |
| 400 GARDEN CITY PLAZA |
| GARDEN CITY, NY 11530 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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