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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09783043
Filing Dt:
02/15/2001
Publication #:
Pub Dt:
04/11/2002
Inventors:
Seung-Man Choi, Ki-Chul Park, Hyeon-Deok Lee
Title:
Method for forming damascene interconnection of semiconductor device and damascene interconnection fabricated thereby
Assignment: 1
Reel/Frame:
011560/0183Recorded: 02/15/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/08/2001
Exec Dt:
02/09/2001
Exec Dt:
02/09/2001
Assignee:
PALDAL-GU
416, MAETAN-DONG
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
JONES VOLENTINE, LLC
ADAM C. VOLENTINE
12200 SUNRISE VALLEY DRIVE, SUITE 150
RESTON, VA 20191

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