Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/08/2003
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Application #:
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09887646
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Filing Dt:
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06/22/2001
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Publication #:
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Pub Dt:
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04/25/2002
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Inventors:
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Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Phuah Kian Keung, Lee Huan Sin
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Title:
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METHOD FOR SAWING A MOULDED LEADFRAME PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| JELAPANG, P.O. BOX 380 |
| LOT 52986, TAMAN MERU INDUSTRIAL ESTATE |
| 30720 IPOH, PERAK D.R., MALAYSIA |
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| WOLF, GREENFIELD & SACKS, P.C. |
| JOHN R. VAN AMSTERDAM |
| FEDERAL RESERVE PLAZA |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEVEL 9, WISMA HONG LEONG |
| 18 JALAN PERAK |
| KUALA LUMPUR, MALAYSIA 50450 |
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| WILLIAM L. SHAFFER |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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