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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09982144
Filing Dt:
10/19/2001
Publication #:
Pub Dt:
05/02/2002
Inventors:
Hideo Nakagawa, Eiji Tamaoka, Masafumi Kubota, Tetsuya Ueda
Title:
Semiconductor device and method for fabricating the same
Assignment: 1
Reel/Frame:
012282/0425Recorded: 10/19/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/15/2001
Exec Dt:
10/16/2001
Exec Dt:
10/16/2001
Exec Dt:
10/16/2001
Exec Dt:
10/16/2001
Exec Dt:
10/16/2001
Assignee:
1006, OAZA KADOMA, KADOMA-SHI
OSAKA 571-8501, JAPAN
Correspondent:
NIXON PEABODY LLP
ERIC J. ROBINSON
8180 GREENSBORO DRIVE
SUITE 800
MCLEAN, VA 22102
Assignment: 2
Reel/Frame:
012961/0519Recorded: 06/04/2002Pages: 4
Conveyance:
RE-RECORD TO CORRECT THE NAMES OF THE ASSIGNORS', PREVIOUSLY RECORDED ON REEL 012282 FRAME 0425, ASSIGNOR CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
Assignors:
Exec Dt:
10/15/2001
Exec Dt:
10/15/2001
Exec Dt:
10/15/2001
Exec Dt:
10/15/2001
Assignee:
1006, OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8
Correspondent:
NIXON PEABODY LLP
ERIC J. ROBINSON
8180 GREENSBORO DRIVE, SUITE 800
MCLEAN, VIRGINIA 22102

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