Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/25/2003
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Application #:
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10056004
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Filing Dt:
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01/28/2002
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Publication #:
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Pub Dt:
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05/30/2002
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Inventors:
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Chen-Wen Tsai, Chung-Ju Wu, Wei-Feng Lin
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Title:
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BOND PAD STRUCTURE AND ITS METHOD OF FABRICATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 16, CREATION RD. 1 |
| HSINCHU, TAIWAN |
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| NIXON PEABODY LLP |
| DONALD R. STUDEBAKER |
| 8180 GREENSBORO DRIVE |
| SUITE 800 |
| MCLEAN, VA 22102 |
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Assignment:
2
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RE-RECORD TO CORRECT ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL/FRAME 012536/0995.
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| NO. 16, CREATION RD. 1 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| NIXON PEABODY LLP |
| DONALD R. STUDEBAKER |
| 8180 GREENSBORO DRIVE |
| SUITE 800 |
| MCLEAN, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE ROAD, SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| TRANSPACIFIC IP LTD. |
| RM.1402, 14TH FL. NO.205, DUNHUA N. RD. |
| TAIPEI CITY, 105 TAIWAN |
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