Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/01/2003
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Application #:
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09261972
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Filing Dt:
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03/03/1999
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Publication #:
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Pub Dt:
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06/06/2002
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Inventors:
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TOMOMI INO, AKIRA SOGA, YOSHIAKI AKAMA
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Title:
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TEMPERATURE MEASURING METHOD AND APPARATUS, MEASURING MEHTOD FOR THE THICKNESS OF THE FORMED FILM, MEASURING APPARATUS FOR THE THICKNESS OF THE FORMED FILM THERMOMETER FOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW ET AL |
| ERNEST F. CHAPMAN |
| 1300 I STREET, N.W. |
| WASHINGTON, DC 20005-3315 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| WORLD TRADE CENTER OF MONTREAL |
| 380 ST. ANTOINE STREET WEST, 8TH FLOOR |
| MONTREAL, QUEBEC, CANADA H2Y 3 |
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| NORTEL NETWORKS LIMITED |
| W. GLEN JOHNSON |
| 2100 LAKESIDE BLVD. |
| M/S 468/05/B10, IP LAW GROUP |
| RICHARDSON, TX 75082-4399 |
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