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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09727833
Filing Dt:
12/01/2000
Publication #:
Pub Dt:
06/06/2002
Inventors:
Ssu-Pin Ma, Shyh-Chyi Wong, Chao-Chieh Tsai
Title:
Method for forming anchored bond pads in semiconductor devices and devices formed
Assignment: 1
Reel/Frame:
011326/0242Recorded: 12/01/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/06/2000
Exec Dt:
11/06/2000
Exec Dt:
11/06/2000
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
NO 121 PARK AVENUE 3
HSIN-CHU, R.O.C., TAIWAN
Correspondent:
TUNG & ASSOCIATES
RANDY W. TUNG
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MICHIGAN 48302

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