Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09729201
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Filing Dt:
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12/05/2000
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Publication #:
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Pub Dt:
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06/06/2002
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Inventors:
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Teng-Chun Tsai, Chia-Lin Hsu, Yung-Tsung Wei, Ming-Sheng Yang
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Title:
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Method for removing carbon-rich particles adhered on the exposed copper surface of a copper/low k dielectric dual damascene structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. 2 |
| HSIN-CHU CITY, TAIWAN R.O.C |
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| LOWE HAUPTMAN GILMAN & BERNER |
| BENJAMIN J. HAUPTMAN |
| 1700 DIAGONAL ROAD |
| SUITE 310 |
| ALEXANDRIA, VA 22314 |
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