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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09833697
Filing Dt:
04/13/2001
Publication #:
20020072216
Pub Dt:
06/13/2002
Inventors:
Wen Lo Shieh, Hsuan Jui Chang, Chia-Chieh Hu, Chung Ming Chang, Hua-Wen Chiang et al
Title:
Manufacturing method for multilayer high density substrate
Assignment: 1
Reel/Frame:
011775/0345Recorded: 04/13/2001Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHIEH, WEN LO
Exec Dt:
03/21/2001
CHUANG, YUNG-CHENG
Exec Dt:
03/21/2001
HUANG, NING
Exec Dt:
03/21/2001
CHEN, HUI-PIN
Exec Dt:
03/21/2001
CHIANG, HUA-WEN
Exec Dt:
03/21/2001
TU, FENG CHANG
Exec Dt:
03/21/2001
HUANG, FU YU
Exec Dt:
03/21/2001
CHANG, HSUAN JUI
Exec Dt:
03/21/2001
HU, CHIA-CHIEH
Exec Dt:
03/21/2001
Assignee:
ORIENT SEMICONDUCTOR ELECTRONICS LIMITED
N.E.P.Z.
12-2 NEI HUAN SOUTH ROAD
KAOHSIUNG, TAIWAN
Correspondent:
WEN LO SHIEH
PO BOX 82-144
TAIPEI, TAIWAN

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