Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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09932053
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Filing Dt:
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08/18/2001
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Publication #:
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Pub Dt:
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07/04/2002
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Inventors:
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Chi Chuan Wu, Chian Ping Huang, Jui-Yu Chuang, Ho-Yi Tsai, Yude Chu
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Title:
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SEMICONDUCTOR PACKAGE HAVING VERTICALLY MOUNTED PASSIVE DEVICES UNDER A CHIP AND A FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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