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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10043299
Filing Dt:
01/14/2002
Publication #:
Pub Dt:
07/11/2002
Inventor:
Kia Silverbrook
Title:
Wafer scale molding of protective caps
Assignment: 1
Reel/Frame:
012470/0052Recorded: 01/14/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/02/2002
Assignee:
393 DARLING STREET
BALMAIN, NSW, AUSTRALIA 2041
Correspondent:
SILVERBROOK RESEARCH PTY. LTD.
KIA SILVERBROOK
393 DARLING STREET
BALMAIN, NSW 2041 AUSTRALIA
Assignment: 2
Reel/Frame:
030554/0028Recorded: 06/05/2013Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/18/2012
Assignee:
44-48 WATERLOOK ROAD
NORTH RYDE, AUSTRALIA 2113
Correspondent:
SILVERBROOK RESEARCH PTY LTD
393 DARLING STREET
BALMAIN, 2041 AUSTRALIA

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