Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10037062
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Filing Dt:
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10/19/2001
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Publication #:
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Pub Dt:
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08/01/2002
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Inventors:
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Yoshimi Sugaya, Makoto Iwakiri
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Title:
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DIE FOR DIE COMPACTING OF POWDERED MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 520, MINORIDAI, MATSUDO-SHI |
| CHIBA, JAPAN |
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| KILPATRICK STOCKTON LLP |
| JOHN S. PRATT |
| SUITE 2800 |
| 1100 PEACHTREE STREET |
| ATLANTA, GA 30309-4530 |
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