Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09776465
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Filing Dt:
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02/02/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Inventor:
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Anthony L. Coyle
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Title:
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FLIP CHIP SEMICONDUCTOR DEVICE IN A MOLDED CHIP SCALE PACKAGE (CSP) AND METHOD OF ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MS 3999 |
| P.O. BOX 655474 |
| DALLAS, TEXAS 75265 |
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| TEXAS INSTRUMENTS INCORPORATED |
| GARY C. HONEYCUTT |
| P.O. BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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