Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09778065
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Filing Dt:
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02/07/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Inventors:
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Minh Q. Tran, Richard J. Huang
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Title:
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Method for removing copper from a wafer edge
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE AMD PLACE, P.O.BOX 3453 |
SUNNYVALE, CALIFORNIA 94088 |
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MCDERMOTT, WILL & EMERY |
JOHN A. HANKINS |
600 13TH STREET, N.W. |
WASHINGTON DC 20005 |
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