Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10134593
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Filing Dt:
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04/30/2002
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Publication #:
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Pub Dt:
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08/15/2002
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Inventors:
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Lang-Fu Tsai, Hsin-Hung Lin, Yuh-Long Lin, Hsuan Peng, Chi-Shien Lee, Wen-Min Hsu et al
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Title:
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Apparatus having a moving mold clamping seat for high temperature fluid injection molding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 CHUNG HSING RD., SEC 4 |
| CHUTUNG JEN, HSIN CHU HSIEN, TAIWAN R.O.C |
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| RABIN & BERDO, P.C. |
| PHILLIP G. AVRUCH |
| 1101 14TH STREET, N.W, SUITE 500 |
| WASHINGTON, DC 20005 |
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