Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10034827
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Filing Dt:
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01/03/2002
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Publication #:
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Pub Dt:
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08/22/2002
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Inventors:
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Gary P. Morrison, Darvin R. Edwards, Leslie Stark
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Title:
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Chip-scale packages stacked on folded interconnector for vertical assembly on substrates
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| M/S 3999 |
| P.O. BOX 655474 |
| DALLAS, TEXAS 75265 |
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| GODWIN GRUBER, P.C. |
| GARY C. HONEYCUTT |
| 801 E. CAMPBELL RD., SUITE 655 |
| RICHARDSON, TX 75081 |
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