Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10104108
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Filing Dt:
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03/22/2002
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Publication #:
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Pub Dt:
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08/22/2002
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Inventors:
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Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi et al
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Title:
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Solder composition for electronic devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME CHIYODA-KU |
| TOKYO,, JAPAN |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| ROBERT C. COLWELL |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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