Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
10/01/2002
|
Application #:
|
09817264
|
Filing Dt:
|
03/27/2001
|
Publication #:
|
|
Pub Dt:
|
10/03/2002
| | | | |
Inventors:
|
Wen-Chun Liu, Yung-Chao Jen, Ming-Feng Wu
|
Title:
|
ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
1, EAST 1ST ST., K.E.P.Z. |
KAOHSIUNG,, TAIWAN |
|
|
|
PARKHURST & WENDEL, L.L.P. |
ROGER W. PARKHURST |
1421 PRINCE STREET |
SUITE 210 |
ALEXANDRIA, VA 22314-2805 |
|
|
Search Results as of:
06/18/2024 12:10 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|