Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10111658
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Filing Dt:
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04/25/2002
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Publication #:
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Pub Dt:
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10/24/2002
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Inventors:
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Kohei Toyama, Tsubasa Shimizu
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Title:
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Packaging bag for semiconductor wafer and method of packaging semiconductor wafer using the packaging bag
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| KOSUGI BLDG., 1-403, KOSUGI-CHO, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN |
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| HOGAN & HARTSON LLP |
| NATHONY J. ORLER, ESQ. |
| 500 SOUTH GRAND AVENUE |
| SUITE 1900 |
| LOS ANGELES, CA 90071 |
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