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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09841745
Filing Dt:
04/25/2001
Publication #:
Pub Dt:
10/31/2002
Inventor:
Eli Toledano
Title:
Dicing method and apparatus for cutting panels or wafers into rectangular shaped die
Assignment: 1
Reel/Frame:
011739/0362Recorded: 04/25/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/05/2001
Assignee:
300 DELAWARE AVE., SUITE 533
WILMINGTON, DELAWARE 19801
Correspondent:
RATNER & PRESTIA
PAUL PRESTIA
ONE WESTLAKES, BERWYN, SUITE 301
P.O. BOX 980
VALLEY FORGE, PA 19482-0980
Assignment: 2
Reel/Frame:
017718/0533Recorded: 06/05/2006Pages: 6
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/21/2005
Assignee:
1005 VIRGINIA DRIVE
FORT WASHINGTON, PENNSYLVANIA 19034
Correspondent:
CHRISTOPHER M. SPLETZER, SR.
1005 VIRGINIA DRIVE
FORT WASHINGTON, PA 19034

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