Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10132895
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Filing Dt:
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04/25/2002
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Publication #:
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Pub Dt:
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10/31/2002
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Inventor:
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Tobita Masayuki
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Title:
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HEAT CONDUCTIVE MOLDED BODY AND MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8-10-1 TAJIMA, SAKURA-KU, SAITAMA-CITY |
| SAITAMA, JAPAN 338-0837 |
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| CECELIA M. PERRY |
| MCGLEW AND TUTTLE, P.C. |
| SCARBOROUGH STATION |
| SCARBOROUGH, NY 10510-9227 |
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