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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09848482
Filing Dt:
05/03/2001
Publication #:
Pub Dt:
11/07/2002
Inventors:
Derrick E. Cook, Peter A. Hatch, Paul William Keberly
Title:
Use of doped synthetic polymer materials for packaging of power electric assemblies for a liquid cooled module
Assignment: 1
Reel/Frame:
011791/0065Recorded: 05/03/2001Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/09/2001
Exec Dt:
02/12/2001
Exec Dt:
02/09/2001
Assignee:
THE AMERICAN ROAD
DEARBORN, MICHIGAN 48121
Correspondent:
FORD GLOBAL TECHNOLOGIES, INC.
KARL A. VICK
SUITE 600 - PARKLANE TOWERS EAST
ONE PARKLAND BOULEVARD
DEARBORN, MI 48126
Assignment: 2
Reel/Frame:
011791/0048Recorded: 05/03/2001Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/12/2001
Assignee:
15001 COMMERCE DRIVE NORTH
DEARBORN, MICHIGAN 48120
Correspondent:
FORD GLOBAL TECHNOLOGIES, INC.
KARL A. VICK
ONE PARKLANE BOULEVARD
PARKLANE TOWERS EAST - SUITE 600
DEARBORN, MI 48126

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