Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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09846932
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Filing Dt:
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05/01/2001
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Publication #:
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Pub Dt:
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11/07/2002
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Inventors:
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Ming Lu, Szu-Wei Lu
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Title:
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METHOD FOR FORMING WAFER LEVEL PACKAGE HAVING SERPENTINE-SHAPED ELECTRODE ALONG SCRIBE LINE AND PACKAGE FORMED
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SEC. 4, CHUNG HSING ROAD |
| CHUTUNG, HSINCHU, TAIWAN 310 |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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