Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/14/2003
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Application #:
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09905754
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Filing Dt:
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07/14/2001
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Publication #:
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Pub Dt:
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11/07/2002
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Inventors:
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Tzong Da Ho, Chien Ping Huang
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Title:
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SEMICONDUCTOR PACKAGE WITH EMBEDDED HEAT-DISSIPATING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAICHUNG R.O.C., TAIWAN |
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| DIKE, BRONSTEIN, ROBERTS ET AL. |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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